Low pressure molding is a new injection molding process in recent years.

Low pressure molding production is a process uses hot liquidify Polyamide material.

Our research team make their efforts on the designing of low-pressure machine, King's Solution Corp. recently have 5 new patents (i.e.  Taiwan patents no. M496549, M525837 and M530471), (China patents no. ZL201420646124.2 and no. ZL201420647977.8).

Our LPM Low Pressure Molding Machine, CE marking certified, with its very low injection pressure 20~500psi (1.5~35 BAR) into the mold cavity and electronic parts to be encapsulated. Hot-melt Polyamide starts cooling down when it touches the cavity, then apply continuous injection pressure. The over-molding process will not harm any fragile solder joint of the circuit board (PCB Overmolding). At first, it's uses to replace toxic and bulky conventional potting processes, gradually spread to the world in market such as automotive market, medical, military, domestic appliance market.

Low pressure molding leads the way to protect fragile electronics components against moisture, dust-proof, moisture proof, insulation, temperature resistance, flame retardant, vibration reduction, well bonding, waterproof etc. Suitable for electronic components such as micro switches that require waterproof function, automotive electronic sensor.

Best for PCB Overmolding, Waterproof Cable Overmolding, Waterproof Micro Switch.