Designed as part of a collaborative project with the Taiwanese Ministry of Economic Affairs. The CPU and bridging features significantly reduce the defect rate.
Utilizes high precision servo motors and pneumatic valves to flatten the IC board. The temperature of the upper/lower press heads is kept in a strict range, thus enabling the IC board solder ball flatness to achieve 8μm or less.
The latest model can produce a flattening pressure of over 1000kg, and is therefore capable of processing intel® Core™2 Duo CPU boards. Parallelism and surface area flatness are automatically adjusted to 8μm or less.
Tie-bar less (C type) design gives more space for operation. Especially suitable for the powercord and connector with wire.
With double slide table or rotary design, put-in, take-out products and molding finish at the same time, which is more safe and efficient for production , then reduce the cost of production.
High precision mold platen ( Parralelism/ flatness : 0.01/100mm), heavy-duty tie-bars, and low-pressure mold clamping work together to greatly extend machine & mold life.
Nitride and NIP/ Nitroflon coated screws and barrels are long-lasting, robust and provide superior acid/alkaline resistance.
Heavy-duty double cylinder injection unit is maintenance friendly and free of oil leaks.
All series adapted Variable pump +PQ valves enable energy savings of 30~50%.
Proportional hydraulic control system provides low noise, low energy consumption, and smooth machine movements with durable life.
Low oil temperature, durable parts, high speed injection, and quiet operation.
Controller can record the production conditions such as temperature, pressure, flow, position available on the panel, reducing adjust of machine.
All machine with compact , space-saving design, reduce the heavy burden of the floor of factory.